Tsara da masana'antu na da'irar da aka hade: daga ra'ayi don aiwatarwa
Tsarin masana'antu na da'irar da aka hade (ICS) mai rikitarwa da mai laushi wanda ke farawa da ɗaukar ƙirar ra'ayi da ƙare tare da samar da samfurin ƙarshe.Ga masu zanen kaya, fahimtar zurfin kowane bangare na zane da masana'antu ba wai kawai haɗuwa don zaɓin keɓancewar lantarki ba don biyan wasu ƙa'idodi da farashikasafin kudi..A yayin wannan tsari, akwai matakai da yawa waɗanda masu zane zasu kiyaye.
Haɓaka mai ƙarfi na tsarkakakku
The Corcenstone na da'irar da aka haɗa shi shine tushe mai wafer, dandamali wanda ke ɗaukar dukkan abubuwa na da'irar haɗin.Ingancin wafer kai yana shafar daidaitattun ayyukan samfurin ƙarshe, don haka yana da mahimmanci don zaɓar kayan sasanta.Hanyar czhochralski hanya ce ta al'ada da ake amfani da ita wajen samar da manyan-sigar Silicon na Silicon.Tsarin ya ƙunshi dumama da narke silicon-aji silicon a cikin babban zazzabi na kusan 1,500 digiri Celsius, a hankali sanyaya shi a cikin manyan silicon girma tare da wafers na bakin ruwa.Kodayake wannan matakin shine lokacin shan lokaci, yana da mahimmanci don tabbatar da ingancin wafer, saboda kawai ainihin ingancin waferin ne kawai na iya tabbatar da aminci da aikinta na da'irar da aka haɗa.
Ginin da aka yiwa layali: Kyakkyawan aiki mai kyau ta Layer
An gina tattarawa a cikin da'irar da aka haɗa ta hanyar adana abubuwa da yawa, kamar masu ɗaukar hoto, abubuwa masu yawa, da transists, Layer a kan subtica substrate.Waɗannan abubuwan za a iya gina waɗannan kayan haɗin ta amfani da kaddarorin n-nau'in da nau'in semiconductors.Cikakken da'irar da aka haɗa na iya ƙunsar da yawa kamar 30 ko fiye yadudduka, da kuma gina kowane Layer na buƙatar sarrafawa daidai.Don cimma wannan burin, ƙayyadadden bayanai na P-Type da n-nau'in wurare na kowane Layer dole ne a bayyana a farkon don tabbatar da daidaito a kowane mataki na gaba.
A daidai aikin kowane Layer an samu ta hanyar dabarun etching, tsari wanda ya shafi ƙirƙirar siffofin geometric da layi a takamaiman wurare.Bugu da kari, ana iya aiwatar da fasalin wafer ta hanyar ajiya, etching, ko doping.Ajiye shine tsari na samar da fim na bakin ciki na kayan a kan wafer, ko dai a zahiri ko ta hanyar sinadaran sunadarai.Etching shine tsari da aka yi amfani da shi don cire abu mai yawa, yawanci amfani da fasahar maimaitawa (Rie).Doping yana canza canje-canje na kayan ta hanyar yin amfani da ƙarin atoms cikin yanayin wafer don samar da kayan p-nau'in abubuwa.