Design and ukukhiqizwa kwemibuthano ehlanganisiwe: Kusuka kumqondo kuya ekusetshenzisweni
Inqubo Yokukhiqiza Yemibuthano Ehlanganisiwe (i-ICS) iyindlela eyinkimbinkimbi futhi ebucayi eqala ngokukhulelwa komklamo womqondo futhi iphela ngokukhiqizwa komkhiqizo wokugcina.Abaqambi be-IC, ukuqonda okujulile kwazo zonke izici zokuklama nokukhiqiza akusona nje isisekelo sokuthola imikhiqizo yokujikeleza ukusebenza okuhlangene nokukhetha umenzi wesicelo esikulindelwe ukuze ahlangabezane namazinga wekhwalithi nezindlekoIzabelomali..Ngale nqubo, kunezinyathelo ezimbalwa ezibalulekile okufanele abaqambi bazikhumbule.
Ukuthuthukiswa kwezindawo zokuhlanzeka eziphakeme
Itshe le-Cornerstone lomjikelezo ohlanganisiwe yisisekelo se-safe, ipulatifomu ethwala zonke izakhi zesifunda esihlanganisiwe.Izinga le-wafer lithinta ngqo ukuguquguquka kokusebenza komkhiqizo wokugcina, ngakho-ke kubalulekile ukukhetha izinto eziphakeme zemithi yokuhlanza.Indlela ye-CZOCHRalski yindlela yakudala esetshenziselwa ukukhiqiza ama-silicon we-silicon e-Crystal.Le nqubo iqukethe ekushiseni nasekunciphiseni i-Silicon ebangeni le-Electronic-grade ekushiseni okuphezulu kwama-degree acishe abe ngu-1,500 ama-degrees, bese uyipholisa kancane kancane ezinsukwini ezimbalwa ukwakha izimo ezinkulu ze-silicon ezinama-wafers amancane.Yize lesi sinyathelo sidla isikhathi, kubalulekile ukuqinisekisa ikhwalithi yesikhathi esisezingeni eliphakeme, ngoba kuphela ama-wafers ayisisekelo asezingeni eliphakeme angaqinisekisa ukuthembeka nokwenza ukusebenza kwemibuthali ehlanganisiwe.
Ukwakhiwa okuyisisekelo: Ungqimba oluhle
Kwakhiwa Circuits okuhlanganisiwe ngokufaka izingxenye eziningi, njengama-capacitors, ama-diodes, kanye nama-transistors, ungqimba ngesendlalelo ku-semicinductor substrate.Lezi zingxenye zingakhiwa kalula ngokusebenzisa izakhiwo zohlobo lwe-N-TICEDE.Isendlalelo esihlanganisiwe esiphelele ingaqukatha izingqimba eziningi ezingama-30 noma ngaphezulu, nokwakhiwa kwesendlalelo ngakunye kudinga ukulawulwa okuqondile.Ukufeza le nhloso, ukucaciswa kwezindawo ze-P-Type ne-N-Type Izindawo zesendlalelo ngasinye kufanele kusethwe ngokusobala ukuze kuqinisekiswe ukunemba kuzo zonke izinyathelo ezilandelayo.
Ukucutshungulwa okuqondile kwesendlalelo ngasinye kutholakala ngamasu we-etching, inqubo efaka ukudala amajamo wejometri nemigqa ezindaweni ezithile.Ngaphezu kwalokho, ukuguqulwa kwe-Wafer kungenziwa okwenziwe ngokwenza imali, ukufakwa, noma ukudonsa.Isimo yinqubo yokwenza ifilimu elincanyana lezinto ezibonakalayo ku-wafer, kungaba emzimbeni noma ngokusabela kwamakhemikhali.I-Etching yinqubo esetshenziselwa ukususa izinto ezengeziwe, imvamisa usebenzisa ubuchwepheshe obusebenzayo i-Ion etching (Rie) Technology.I-DOPING ishintsha ukuthuthuka kwezinto ngokufaka ama-athomu angeziwe endaweni ebukhali ukuze wenze izinhlobo ze-N-Type.